Kohesi Bond Bhandup West, Mumbai, Maharashtra

Features : Impact Resistant , Shock Resistant , Vibration Resistan

Kohesi Bond TUF 1828 TC is a toughened, single component, thermal management epoxy system that offers an unlimited working life at room temperature. Firstly, this product offers phenomenal heat transfer capabilities. This products has very low thermal resistance and can be applied in layers as thin as 10 microns. The efficiency heat transfer improves exceedingly with lower thermal resistance. This can be explained easily with the following formula: R = lK "R" is the thermal resistance; "l" is the adhesive layer thickness; "K" is the thermal conductivity of the adhesive] Applying peculiar values, standard thermally conductive adhesives (alumina filled) that are applicable in more than 50 micron thicknesses, offer a thermal resistance of 35 40 10-6 m2·KW. Since TUF 1828 TC can be applied in 10 micron thick sections, it offers a notably low thermal resistance of 5 - 6 x 10-6 m2·KW. TUF 1828 TC is cryogenically serviceable. Being a one component system, it provides ease of application and also adheres well to a wide variety of substrates including metals, ceramics, composites, most plastics and glass. It provides superior bonding and physical strength properties. It has a gray color. Owing to its sensational thermal management properties and low outgassing properties TUF 1828 TC is widely used in electronics, optical, aerospace, specialty OEM and cryogenic industries. PRODUCT HIGHLIGHTS Unrivaled heat transfer efficiency Cryogenically serviceable Superb mechanical strength properties Microns thin bond lines achievable Capable of passing NASA low outgassing Unlimited working life at room temperature TYPICAL APPLICATIONS : Bonding, Sealing

Kohesi Bond TUF 1820 HTS is a toughened, single component, silver conductive epoxy system that requires no mixing and offers an unlimited working life at room temperature. Firstly, this product offers phenomenal electrical as well as thermal conductivity. It cures in merely 60 � 80 minutes at 120°C and even faster at higher temperatures. TUF 1820 HTS offers an extremely wide serviceable temperature range of 4K (-269.15°C) to +200°C. This product can withstand severe thermal cycling and shocks even at cryogenic temperatures. Being a one component system, it provides ease of application and also adheres well to a wide variety of substrates including metals, ceramics, composites, most plastics and glass. It provides superior bonding and physical strength properties as well as outstanding dimensional stability. TUF 1820 HTS is a 100% solids and a reactive system i.e. it does not contain any solvents or diluents. It has a silver gray color. It also extends first-rate chemical resistance to a variety of acids, bases, fuels and water. Owing to its dazzling performance, capability of passing NASA low outgassing test and ease of use, TUF 1820 HTS is widely used in demanding electronics, optoelectronic, aerospace, specialty OEM and various vacuum based applications. PRODUCT HIGHLIGHTS Silver filled electrically conductive Cryogenically serviceable Superb mechanical strength properties First-rate peel strength Capable of passing NASA low outgassing Unlimited working life at room temperature TYPICAL APPLICATIONS : Bonding, Sealing Industrial Certification : RoHS Compliant and NASA (Low Outgassing ASTM E-595)

Kohesi Bond TUF 1820 AOHT is a noteworthy toughened, single component epoxy system that requires no mixing and offers an unlimited working life at room temperature. It cures in merely 60 - 70 minutes at 120°C and even faster at higher temperatures. TUF 1820 AOHT offers a sweeping serviceable temperature range of 4K (-269.15°C) to +200°C. This product can withstand severe thermal cycling and shocks even at cryogenic temperatures. Being a one component system, it provides ease of application and also adheres well to a wide variety of substrates including metals, ceramics, composites, most plastics and glass. It provides phenomenal bonding and physical strength properties, as well as dimensional stability. It offers a startling tensile lap shear strength of over 3,800 psi. TUF 1820 AOHT is a 100% solids and a reactive system i.e. it does not contain any solvents or diluents. In addition to superior electrical insulation, TUF 1820 AOHT also offers very good thermal conductivity. It has a gray color. It also extends first-rate chemical resistance to a variety of solvents, fuels and water. Owing to its high-caliber performance and ease of use, TUF 1820 AOHT is widely used in various other electronics, optoelectronic, aerospace and specialty OEM applications. PRODUCT HIGHLIGHTS Excellent thermal conductivity Cryogenically serviceable Stellar mechanical strength properties Outstanding dimensional stability Resistance to extreme thermal cycling Unlimited working life at room temperature TYPICAL APPLICATIONS : Bonding, Sealing Industrial Certification : RoHS Compliant

Kohesi Bond TUF 1820 ANHT is a toughened, single component epoxy system that offers phenomenal thermal conductivity while maintaining its superior electrical insulation properties. It requires no mixing and offers an unlimited working life at room temperature. It cures in merely 60 - 90 minutes at 120°C and even faster at higher temperatures. TUF 1820 ANHT offers an across-the-board serviceable temperature range of 4K (-269.15°C) to +200°C. This product can withstand severe thermal cycling and shocks even at cryogenic temperatures. Being a one component system, it provides ease of application and also adheres well to a wide variety of substrates including metals, ceramics, composites, most plastics and glass. It provides phenomenal bonding and physical strength properties, extremely low coefficient of thermal expansion and outstanding dimensional stability. TUF 1820 ANHT is a 100% solids and a reactive system i.e. it does not contain any solvents or diluents. It has a gray color and a smooth paste like consistency. It also extends first-rate chemical resistance to a variety of solvents, fuels and water. Owing to its heroic performance and ease of use, TUF 1820 ANHT is widely used in sophisticated electronics, optoelectronic, aerospace and specialty OEM applications. PRODUCT HIGHLIGHTS Sensational thermal conductivity Cryogenically serviceable Superb mechanical strength properties Outstanding dimensional stability Low coefficient of thermal expansion (CTE) Unlimited working life at room temperature TYPICAL APPLICATIONS : Bonding, Sealing Industrial Certification : RoHS Compliant

Kohesi bond tuf 1621 aoht is a two component, room temperature curing epoxy system suitable for bonding and sealing. It is capable of passing nasa standards for low outgassing (astm e-595) and has a convenient 1:1 (part a: part b) mix ratio by weight or volume. This unique epoxy system offers remarkable toughness and superior peel strength. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°c - 90°c for 3 - 5 hours. Tuf 1621 aoht is thermally conductive and it can withstand very high temperatures. It offers an extensive serviceable temperature range of -70°c to +200°c. This phenomenal adhesive fosters outstanding resistance to mechanical and thermal shocks. It offers exceptionally high lap shear strength (> 3,300 psi). Tuf 1621 aoht adheres well to a wide variety of substrates including metals, ceramics, most plastics, rubbers and glass. In addition to superior electrical insulation, it also offers very good resistance to various chemicals, such as water, oils and fuels. Part a and part b are off-white in color. Tuf 1621 aoht is widely used in electronic, optoelectronic, vacuum, aerospace and related industries. Product highlights superior thermal conductivity excellent toughness convenient 1:1 mix ratio first-rate thermal conductivity exceptional electrical insulation properties capable of passing nasa low outgassing typical applications : bonding, sealing, coating industrial certification : rohs compliant and nasa (low outgassing astm e-595)

Kohesi bond tuf 1613 ht-sm is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120â°c for curing (at which it cures extraordinarily fast), it can achieve even faster cures at higher temperatures. Tuf 1613 ht-sm offers an extensive serviceable temperature range of -70â°c to +180â°c. This product can withstand severe thermal cycling and shocks. Being a one component system, it provides ease of application and also adheres well to a wide variety of substrates including metals, ceramics, composites, most plastics and glass. It provides outstanding bonding and physical strength properties, as well as dimensional stability. Tuf 1613 ht-sm is a 100% solids and a reactive system i.e. It does not contain any solvents or diluents. In addition to superior electrical insulation, tuf 1613 ht-sm also offers very good thermal conductivity. It offers very smooth paste like consistency and does not tail when dispensed. It has a tan - brown color and it can be color matched to your specifications. With an ideal dispensing profile, tuf 1613 ht-sm although most commonly used for surface mount applications, its superior performance also makes it suitable for use in various other electronics, aerospace and distinctive oem applications. Product highlights thermally conductive low ionic content extremely fast cure outstanding dimensional stability superb electrical insulator unlimited working life at room temperature typical applications : surface mount, bonding, sealing industrial certification : rohs compliant

Kohesi bond tuf 1613 ht-gt is a single component, toughened epoxy system that requires no mixing and cures rapidly at elevated temperatures. Although it requires a minimum temperature of 120â°c for curing (at which it cures extraordinarily fast), it can achieve even faster cures at elevated temperatures. Tuf 1613 ht-gt offers an extensive serviceable temperature range of -70â°c to +200â°c. Being a one component system, it provides ease of application and also adheres well to a broad variety of substrates including metals, ceramics, most plastics and glass. It provides outstanding bonding and physical strength properties, as well as dimensional stability. This product has the ability to withstand arduous thermal cycling and shock. Tuf 1613 ht-gt is a 100% solids and a reactive system i.e. It does not contain any solvents or diluents. It offers minimum shrinkage upon cure and can be cast up to 18 inch thicknesses. In addition to superior electrical insulation, tuf 1613 ht-gt also offers phenomenal thermal conductivity (1.8 - 2 wmk). It has a tan- yellow color. With a unique combination of remarkable performance, this multi-functional epoxy system is universally used as a glob top or die attach and also as an adhesive in various electronics and electrical applications. product highlights low ionic content outstanding thermal conductivity resists thermal shock and cycling fast curing excellent dimensional stability unlimited working life at room temperature typical applications : glob top, coating, sealing, potting, encapsulation industrial certification : rohs compliant

Kohesi bond tuf 1613 ht-da is a fast curing, true single component epoxy system for die attach applications. Unlike other die attach systems, tuf 1613 ht-da is not a premixed and frozen system. It only needs elementary refrigeration for storage and offers an unlimited working life at room temperature. It cures exceptionally fast in 5 - 10 minutes at 150â°c. Tuf 1613 ht-da dispenses ideally leaving no tail behind and can be easily used with automated dispensing equipment. It offers an extensive serviceable temperature range of -70â°c to +200â°c. It adheres well to a broad variety of substrates including metals, ceramics, most plastics and glass. It provides outstanding die shear strength and is capable of passing nasa low outgassing test specifications. Tuf 1613 ht-da offers phenomenal thermal conductivity of 1.4 - 1.5 wmk. It has the capability to withstand ard-uous thermal cycling. In addition to superior electrical insulation, tuf 1613 ht-da also offers less than 1% weight change after rigorous 168 hours of 85â°c85% rh test. It has a standard light yellow - tan color. This perfect combination of remarkable performance, ease of use, incomparable die shear strength and dimensional stability makes tuf 1613 ht-da a guru for die attach applications. Product highlights remarkable die shear strength ultimate dispensing profile thermally conductive low ionic content (chlorine < 15 ppm) capable of passing nasa low outgassing unlimited working life at room temperature typical applications : die attach, bonding, sealing industrial certification : rohs compliant and nasa (low outgassing astm e-595

Kohesi Bond TUF 1613 HT-CM is a toughened, single component system that requires no mixing and cures readily at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at higher temperatures. TUF 1613 HT-CM offers an extensive serviceable temperature range of -70°C to +200°C. This product can withstand severe thermal cycling and shocks. Being a one component system. it provides ease of application and also adheres well to a wide variety of substrates including metals, ceramics, composites, most plastics and glass. It provides outstanding bonding and physical strength properties, as well as dimensional stability. TUF 1613 HT-CM is a 100% solids system i.e. it does not contain any solvents or diluents. In addition to superior electrical insulation, TUF 1613 HT-CM also offers very good thermal conductivity. It has a black color. It also extends phenomenal chemical resistance to a variety of acids, bases, fuels and water. TUF 1613 HT-CM although most commonly used for glop topping, its superior performance and the ability to pass NASA low outgassing standards, makes it suitable for use in various electronics, aerospace and vacuum applications. PRODUCT HIGHLIGHTS Thermal conductivity; efficient heat transfer Superior electrical insulation Rapid cures Outstanding dimensional stability Capable of passing NASA low outgassing Unlimited working life at room temperature TYPICAL APPLICATIONS : Bonding & Sealing, Coating, Potting, Glob Top, Die Attach Industrial Certification : RoHS Compliant and NASA (Low Outgassing ASTM E-595)

Kohesi bond tuf 1452 ht-2 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 100:40 (part a: part b) mix ratio by weight or 100:50 (part a: part b) mix ratio by volume. This unique epoxy system offers remarkable adhesion to wide variety of substrates including metals, ceramics, most plastics and glass. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°c - 90°c for 3 - 5 hours. Tuf 1452 ht-2 is a toughened system, offering low exotherm and a long working life. It can withstand multiple cycles of thermal and mechanical shocks. It offers an extensive serviceable temperature range of -60°c to +220°c. This phenomenal adhesive fosters outstanding physical strength properties as well as dimensional stability. It offers minimal shrinkage upon cure and is suitable for medium sized castings. In addition to superior electrical insulation, it also offers astounding chemical resistance to a variety of acids, bases, solvents, fuels, oils and water. Part a has a tan-brown color and part b has an amber color. Tuf 1452 ht-2 is widely used in the electronics, aerospace and various oem applications. Product highlights high glass transition temperature resists thermal and mechanical shocks very good flow properties superior chemical resistance exceptional electrical insulation properties phenomenal toughness typical applications : bonding, sealing, coating, potting, encapsulation industrial certification : rohs compliant

Kohesi bond kb-ss-scn is a silver coated nickel filled, sodium silicate based coating system. Firstly, this product offers very good electrical conductivity. This products offers very high levels of shielding towards electromagnetic interference (emi) and radio frequency interference (rfi), along with cost effectiveness. Shielding effectiveness is extremely critical for electronic devices, since energy from various appliances such as radios can interfere with their performance. Our conductive coatings are usually applied to housing substrates to protect the devices from any such interference. Shielding effectiveness is measured by attenuation, which refers to the difference in an electromagnetic signal's intensity before and after shielding. The unit of measurement is in decibels (db). Achieving shielding at higher frequencies is extremely challenging. From 1-2 ghz, kb-ss-scn's effectiveness is in the range of 75-42 dbs, similar to an aluminum reference. This rating slowly declines to 56-42 dbs at 2-15ghz and further down to 50 dbs at 18 ghz, at which point it stabilizes. It should be noted that the decibel range of attenuation falls along a logarithmic scale. A 10 db difference in attenuation indicates a 10 times change in shielding effectiveness. Kb-ss-scn has a wide serviceable temperature range of -18°c to +370°c. It is a water based system, making it relatively non-toxic. This product can be easily applied with a brush or a spraying system. It can cure at room temperature in 1-2 days or it can be heat cured at 80°c for 1-2 hours. Product highlights unrivaled electrical conductivity offers cost effectiveness very good shielding effectiveness resists more than 370°c effective moisture barrier ease of application typical applications : coating industrial certification : rohs compliant

Kohesi bond kb-ss-g is a graphite filled, sodium silicate based coating system. Firstly, this product offers very good electrical conductivity. This products offers high levels of shielding towards electromagnetic interference (emi) and radio frequency interference (rfi), along with cost effectiveness. Shielding effectiveness is extremely critical for electronic devices, since energy from various appliances such as radios can interfere with their performance. Our conductive coatings are usually applied to housing substrates to protect the devices from any such interference. Shielding effectiveness is measured by attenuation, which refers to the difference in an electromagnetic signal's intensity before and after shielding. The unit of measurement is in decibels (db). Achieving shielding at higher frequencies is extremely challenging. From 1-2 ghz, kb-ss-g's effectiveness is in the range of 35-50 dbs. This rating slowly declines to 45-35 dbs at 2-15ghz and further down to 45 dbs at 18 ghz, at which point it stabilizes. It should be noted that the decibel range of attenuation falls along a logarithmic scale. A 10 db difference in attenuation indicates a 10 times change in shielding effectiveness. Kb-ss-g has a wide serviceable temperature range of -18°c to +370°c. This product can be easily applied with a brush or a spraying system. It can cure at room temperature in 1-2 days or it can be heat cured at 80°c for 1-2 hours. Product highlights superb electrical conductivity very cost effective good shielding effectiveness resists more than 370°c effective moisture barrier ease of application typical applications : coating industrial certification : rohs compliant

Kohesi bond kb 1689 is a two component, toughened, silver coated nickel filled epoxy system suitable for bonding and sealing. It has a convenient 1:1 (part a: part b) mix ratio by weight. Firstly, it offers very good electrical conductivity and very low shrinkage upon cure. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°c - 90°c for 3 - 5 hours. Kb 1689 can withstand severe thermal cycling and shocks even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4k (-269.15°c) to +135°c. It is an outstanding adhesive that offers superb bond strength, peel strength and toughness, allowing it to bond dissimilar substrates with different coefficients of thermal expansion. Kb 1689 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical and thermal conductivity (1.8 - 2.3 wmk), it also offers astounding chemical resistance to a variety of fuels, oils and water. Part a and part b have a gray color. Owing to its versatile performance, kb 1689 is widely used in electronics, aerospace, electrical, semiconductor, microwave and various oem applications. Product highlights easy mix ratio of 1:1 by weight outstanding toughness superior thermal conductivity cost effective very low volume resistivity (< 0.005 ohm-cm) cryogenically serviceable typical applications : bonding, sealing industrial certification : rohs compliant

Kohesi bond kb 1686 m is a two component, nickel filled epoxy system suitable for bonding, coating and sealing. It has a convenient 1:1 (part a: part b) mix ratio by weight or volume. Firstly, it offers very good electrical conductivity and dimensional stability. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°c - 90°c for 3 - 5 hours. Kb 1686 m offers a volume resistivity of 5 - 10 ohm-cm. It is ideal for use in static dissipation and emirfi shielding applications. It offers an extensive serviceable temperature range of -50°c to +120°c. It is an outstanding adhesive that offers superb physical strength properties, allowing it to adhere well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical and thermal conductivity (1.3 - 1.4 wmk), it also offers astounding chemical resistance to various cleaning agents, oils and water. Part a and part b are gray in color. It has a thixotropic paste like consistency and a very low coefficient of thermal expansion (cte). Owing to its versatile performance, kb 1686 m is widely used in electronics, aerospace, electrical, semiconductor, microwave and many oem applications. Product highlights easy mix ratio of 1:1 by weight or volume outstanding dimensional stability superior thermal conductivity high lap shear strength (> 2100 psi) nickel filled electrically conductive 100% solids system typical applications : bonding, sealing, coating industrial certification : rohs compliant

Kohesi bond kb 1631 htc-1 is a two component epoxy system suitable for bonding and sealing. It has a 100:60 (part a: part b) mix ratio by weight. Most importantly, it offers stellar thermal conductivity and is capable of passing nasa low outgassing test. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°c - 90°c for 3 - 5 hours. Kb 1631 htc-1 can withstand severe thermal shocks and cycling even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4k (-269.15°c) to +200°c. It is a phenomenal adhesive that fosters outstanding physical strength properties and low coefficient of thermal expansion (cte). Kb 1631 htc-1 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, dimensional stability and thermal conductivity, kb 1631 htc-1 also offers astounding chemical resistance to a variety of acids, bases, fuels, oils and water. Part a and part b have an off-white color. Owing to its remarkable performance and vacuum compatibility kb 1631 htc-1 is widely used in electronics, semiconductor, cryogenic and major oem applications. Product highlights superior thermal conductivity low coefficient of thermal expansion (cte) thixotropic paste superior dimensional stability exceptional electrical insulation properties capable of passing nasa low outgassing typical applications : bonding, sealing industrial certification : rohs compliant and nasa (low outgassing astm e-595)

Kohesi bond kb 1631 fr-2 is a two component, room temperature curing epoxy system. This flame retardant epoxy generates low smoke and contains a non-halogenated filler. Although kb 1631 fr-2 cures hard at room temperature, the optimum cure schedule would be an overnight room temperature set-up followed by an addition of heat at 90°c for 2 - 3 hours. Kb 1631 fr-2 offers an extensive serviceable temperature range of -51°c to +90°c, as per ul 94v-0 specification. This product's exquisite flow properties makes it ideal for use in potting and encapsulation applications. In addition to ease of application, kb 1631 fr-2 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. It provides superior mechanical strength properties and dimensional stability. Kb 1631 fr-2 offers phenomenal electrical insulation. It also offers astounding chemical resistance to a variety of fuels, oils, lubricants and water. Part a has a black color and part b has an off white color. Also, it has a very convenient 1:1 mix ratio by weight. With a unique combination of remarkable performance, ease of use and excellent flame retardant properties, kb 1631 fr-2 is widely used in electronics , microelectronics, aerospace and various oem applications. Product highlights can pass ul94v-0 flame retardant test extremely low smoke generation non-halogen filler room temperature cure convenient mix ratio of 1:1 by weight excellent resistance to fuels and water typical applications : potting, encapsulation, casting industrial certification : rohs compliant and ul94v - 0

Kohesi bond kb 1631 aolv-1 is a two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It offers a favorable one to one mix ratio by weight or volume. In addition, it has a long open time, a low exotherm and good flow properties when mixed, making it ideal for potting and encapsulating. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°c - 90°c for 3 - 5 hours. Kb 1631 aolv-1 offers an extensive serviceable temperature range of -50°c to +120°c. Also, it is a phenomenal adhesive that fosters outstanding physical strength properties and low coefficient of thermal expansion (cte). Kb 1631 aolv-1 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation and thermal conductivity, kb 1631aolv-1 also offers astounding chemical resistance to a variety of fuels, oils and water. Part a has a gray color and part b has an off-white color. Owing to its remarkable performance and ease of use kb 1631 aolv-1 is widely used in electronics, optoelectronic, major oem and similar applications. Product highlights superior thermal conductivity low coefficient of thermal expansion (cte) excellent flow properties superior dimensional stability exceptional electrical insulation properties easy mix ratio of 1:1 by weight or volume typical applications : potting, encapsulation, sealing, coating, bonding industrial certification : rohs compliant

Kohesi Bond KB 1631 ANHT is a two component, room temperature epoxy system suitable for bonding, sealing and coating. It has a very convenient 1:1 (Part A: Part B) mix ratio by weight or volume. Primarily, it offers stellar thermal conductivity, making it ideal for heat transfer applications. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 1631 ANHT being a filled system, offers first-rate dimensional stability and exceptionally low coefficient of thermal expansion. It offers an extensive serviceable temperature range of -50°C to +200°C. It is a phenomenal adhesive offering preeminent physical strength properties. KB 1631 ANHT adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, and thermal conductivity, it also offers astounding chemical resistance to a variety of acids, bases, fuels, oils and water. Part A has a light gray color and Part B has a gray color. Owing to its remarkable performance and heat transfer capabilities KB 1631 ANHT is widely used in electronics, aerospace, quality OEM and other similar industries. PRODUCT HIGHLIGHTS Superior thermal conductivity Easy 1:1 mix ratio by weight or volume Resistant to temperatures as high as 200°C Superior dimensional stability Exceptional electrical insulation properties Low coefficient of thermal expansion TYPICAL APPLICATIONS : Bonding, Sealing, Coating Industrial Certification : RoHS Compliant

Kohesi Bond KB 1613 RLV is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120�°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at elevated temperatures. KB 1613 RLV offers an extensive serviceable temperature range of -50�°C to +180�°C. This product's exquisite flow properties makes it ideal for use in underfill, potting and encapsulation applications. Being a one component system, it provides ease of application and also adheres well to an encyclopedic variety of substrates including metals, ceramics, most plastics and glass. It provides sterling mechanical strength properties and dimensional stability. KB 1613 RLV offers phenomenal thermal conductivity of 1 - 1.2 WmK. In addition to superior electrical insulation, KB 1613 RLV also offers astounding chemical resistance to a variety of fuels, oils and water. It has a light yellow color, but it can be color matched to your specifications upon request. With a unique combination of remarkable performance, ease of use and excellent mechanical strength properties, KB 1613 RLV is widely used in electronics and microelectronics packaging and assembly applications. PRODUCT HIGHLIGHTS Thermally conductive Castable up to 1 inch thicknesses Rapid cures at elevated temperatures Superior dimensional stability Exceptional electrical isolator Unlimited working life at room temperature TYPICAL APPLICATIONS : Underfill, Potting, Encapsulation, Sealing, Coating Industrial Certification : RoHS Compliant

Kohesi Bond KB 1613 R80 is a single component epoxy system suitable for bonding, sealing, potting and encapsulation applications. Being a one component system, it does not require any mixing and offers an unlimited working life at room temperature. Unlike other one component epoxies, this product can be cured at temperatures as low as 80°C. Although superlative properties are obtained with higher temperature cures, good mechanical strength properties and dimensional stability are furnished by 80°C cures as well. KB 1613 R80 offers an extensive serviceable temperature range of -70°C to +180°C. This product�¢ï¿½ï¿½s exquisite flow properties and lower exotherm makes it ideal for use in potting and encapsulation applications for 12�¢ï¿½ï¿½ thicknesses and beyond. KB 1613 R80 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation and thermal conductivity, KB 1613 R80 also offers astounding chemical resistance to a variety of fuels, oils and water. It has a tan �¢ï¿½ï¿½ yellow color. With a unique combination of remarkable performance, ease of use and speedy cures at convenient temperatures, KB 1613 R80 is widely used in electronics, aerospace, major OEM and similar applications. PRODUCT HIGHLIGHTS Thermally conductive Lower exotherm while curing Expeditious cures at 80°C or higher Superior dimensional stability Exceptional electrical insulation properties Unlimited working life at room temperature TYPICAL APPLICATIONS : Potting, Encapsulation, Sealing, Coating, Bonding Industrial Certification : RoHS Compliant

Kohesi Bond KB 1613 HT is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at elevated temperatures. KB 1613 HT offers an extensive serviceable temperature range of -50°C to +200°C. This product can be easily stored at room temperature or in a refrigerator. Being a one component system, it provides ease of application and also adheres well to a broad variety of substrates including metals, ceramics, most plastics and glass. It provides outstanding bonding and physical strength properties, as well as dimensional stability. KB 1613 HT is a 100% solids and a reactive system i.e. it does not contain any solvents or diluents. In addition to superior electrical insulation, KB 1613 HT also offers phe-nomenal chemical resistance to a variety of acids, bases, fuels, oils and water. This epoxy is available in a non-drip, non-sag viscosity which can even be applied on vertical surfaces without dripping. It has a tan brown color. With a unique combination of remarkable performance, ease of use and excellent mechanical strength properties, KB 1613 HT is universally used in electronics, electrical,aerospace and various other industries. PRODUCT HIGHLIGHTS Superior shear strength properties Wide serviceable temperature range Extremely fast cure Outstanding dimensional stability Superb electrical insulator Unlimited working life at room temperature TYPICAL APPLICATIONS : Bonding, Sealing, Coating Industrial Certification : RoHS Compliant

Kohesi Bond KB 1600 FR-V is a two component epoxy system that offers a convenient to use mix ratio of 1:1 by weight. This flame retardant epoxy is capable of passing the vertical burn test specifications as per Amendment 25-116 and Part 25 Appendix F of the FAR standards. Additionally, it contains a non-halogenated filler, making it easy to handle and environmentally friendly. The optimum cure schedule for KB 1600 FR-V would be an overnight room temperature set-up followed by an addition of heat at 90°C for 3 - 5 hours. KB 1600 FR-V offers an extensive serviceable temperature range of -51°C to +121°C. This product's flow properties and long working time makes it ideal for use in potting and encapsulation applications. In addition to ease of application, KB 1600 FR-V adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. KB 1600 FR-V offers phenomenal electrical insulation. It also offers astounding chemical resistance to a variety of fuels, oils, common solvents and water. Part A has a black color and Part B has a white color. This system's color coding aids in proper mixing. Its capability of meeting the FAR standards makes it ideal for use in aviation and avionic related applications, such as door and floor assemblies,interior panels and electronic potting and sealing. PRODUCT HIGHLIGHTS Can pass FAR standard CFR 25.853 (a) Capable of passing vertical burn test Non-halogen filler Low shrinkage upon cure Convenient mix ratio of 1:1 by weight Excellent electrical insulation properties TYPICAL APPLICATIONS : Bonding, Coating, Potting, Encapsulation, Casting Industrial Certification : RoHS Compliant and FAR 25.853 (Federal Aviation Regulation)

Kohesi Bond KB 1458 TC is a one-of-a-kind, two component, thermal management epoxy system. Firstly, this product offers phenomenal heat transfer capabilities. This products has very low thermal resistance and can be applied in layers as thin as 10 microns. The efficiency of heat transfer improves exceedingly with lower thermal resistance. This can be explained easily with the following formula: R = lK [''R''] is the thermal resistance; "l" is the adhesive layer thickness; "K" is the thermal conductivity of the adhesive] Applying peculiar values, standard thermally conductive adhesives (alumina filled) that are applicable in more than 50 micron thicknesses, offer a thermal resistance of 35 - 40 x 10-6 m2·KW. Since KB 1458 TC can be applied in 10 micron thick sections, it offers a notably low thermal resistance of 5 - 6 x 10-6 m2·KW. KB 1458 TC has a wide serviceable temperature range of -70°C to +150°C. It adheres well to a wide variety of substrates including metals, ceramics, composites, most plastics and glass. It provides superior bonding and physical strength properties and very low shrinkage upon cure. In addition, it offers excellent dimensional stability and a very low coefficient of thermal expansion (CTE). Part A and Part B are gray in color. Owing to its sensational thermal management properties KB 1458 TC is widely used in electronics, optical and specialty OEM industries. PRODUCT HIGHLIGHTS Unrivaled heat transfer efficiency Low coefficient of thermal expansion (CTE) Superb mechanical strength properties Microns thin bond lines achievable Phenomenal electrical insulation properties Unlimited working life at room temperature TYPICAL APPLICATIONS : Bonding, Sealing Industrial Certification : RoHS Compliant