Persang Alloy Industries Pvt Ltd. Akota, Vadodara, Gujarat

PAI Sn63Pb37 solder sticks are being formulated with virgin raw metals processed in state-of-theart Vaccualloy Technology that brings world class quality along. Here, oxygen interaction with alloy is nil and thus, dross formation is reduced at PCB assembly or PCB manufacturing processes. Also an increased flow rate & reduced impurities found. PAI Sn63Pb37 is compatible with typical range of flux application formulas used in Electronics Industry today.

PAI SP-610 RoHS compliance solder wires are being formulated with high virgin raw metals processed in state-of-the-art Vaccualloy Technology that brings world class quality along. Here,oxygen interaction with alloy is nil and thus, dross formulation is reduced at PCB assembly process. Also an increased flow rate & reduced impurities found. PAI SP-610 alloy is compatible for a typical range of flux application formulas used in Electronics Industry today.

PAI SP-629 RoHS Compliance Solder Sticks are being formulated with High Virgin Raw Metals Processed in state-of-the-art Vaccualloy Technology that brings world class Quality along. Here, Oxygen interaction with Alloy is Nil and thus, Dross formulation is reduced at PCB Assembly Process. Also an increase flow rate & reduced impurities found. PAI SP-629 Alloy is compatible for a typical range of Flux Application Formulas used in Electronics Industry Today.

PAI SH6209 (Sn62Ag2Pb36) RMA NC Solder Paste     SH-6209 PAI tin/lead/silver no-clean solder pastes are made from a special formulation of highest purity ingredients to ensure the process consistency of today’s demanding ultra-fine-pitch challenges. Our formulation offers a wide processing window and excellent shelf life, with full wetting and clean-ability features to prolong stencil life. SH-6209  is a Sn62Ag2Pb36 alloy with Type 3 & Type 4  and no-clean ROL0 flux. It comes packaged in a 500-gram & 250-grams jar. High print speed (0-120 mm/sec) Excellent wettability Reflow with or without nitrogen Low void Over 8 hours stencil life Extended tack time > 12 hours Download – Technical Data Sheet  

PAI SnPb40 Sticks are being formulated with High Virgin Raw Metals Processed in state-of-the-art Vaccualloy Technology that brings world class Quality along. Here, Oxygen interaction with Alloy is Nil and thus, Dross formulation is reduced at PCB Assembly Process. Also an increase flow rate & reduced impurities found. PAI SnPb40 Alloy is compatible for a typical range of Flux Application Formulas used in Electronics Industry Today.  

PF609 is an SnAg0.3Cu0.7 alloy with Type 3 particle size (+45 µm 1% less, -20 µm 10% less) and Type 4 particle size (+38 µm 1% less, -20 µm 10% less) and no-clean ROL0 flux. It comes packaged in a 500-gram & 250-grams jar.

PAI Sn60/Pb40 Solder Wire ( NC & RC )     High purity alloy that is composed of 60% Tin and 40% Lead from virgin metals.
Applies at hand or feed soldering processes in Electronics & Electrical assemblies.
Non-corrosive and no impact of flux residues forming at post soldering which means ofpassing in pin probe & flying probe tests for No Clean solder wires.
If required, flux residues shall be cleaned with appropriate liquid application.
Précised amount of flux cored from state-of the-art-technology manufacturing process.

PAI Sn/Ag0.3/Cu0.7 ( SAC0307 ) Solder Wire     PAI SnAg0.3Cu0.7+Ni+Ge RoHS compliance solder wires are being formulated with high virginraw metals processed in state-of-the-art Vaccualloy Technology that brings world class qualityalong. Here, oxygen interaction with alloy is nil and thus, dross formulation is reduced at PCBassembly process. Also an increased flow rate & reduced impurities found. PAISnAg0.3Cu0.7+Ni+Ge alloy are compatible for a typical range of flux application formulas used inElectronics Industry today.

PAI PF606 (SAC305) NC Solder Paste     Lead-Free No Clean Solder Paste PART NO: PF606 The higher processing temperatures required for lead-free soldering make unprecedented demands on solder pastes. In addition to consistent printing and reflow requirements, there is a need for higher repeatability in high mix, high-yield lines. All these and other Pb-free challenges are met with consistency in PAI’s lead-free pastes. Processable by air or nitrogen reflow, they offer the advantages of excellent wetting characteristics and long shelf life. PF606  is an Sn/Ag3.0/Cu0.5 alloy with Type 3 particle size (+45 µm 1% less, -20 µm 10% less)  and Type 4 particle size (+38 µm 1% less, -20 µm 10% less) and no-clean ROL0 flux. It comes packaged in a 500-gram & 250-grams jar. Pb < 1000 ppm, Cd < 20 ppm High print speed: 0-120 mm/sec Over 8 hours stencil life Extended tack time > 12 hours Excellent wettability Low void Download – Technical Data Sheet

PAI Sn99.3/Cu0.7 Solder Bar     PAI  Sn99.3Cu0.7  RoHS  Compliance  Solder  Sticks  are  being  formulated  with  High  Virgin  Raw Metals Processed in state-of-the-art  Vaccualloy Technology that brings world class Quality along. Here, Oxygen interaction with Alloy is Nil and thus, Dross formulation is reduced at PCB Assembly Process.  Also  an  increase  flow  rate  &  reduced  impurities  found.  PAI  Sn99.3Cu0.7   Alloy  is compatible for a typical range of Flux Application Formulas used in Electronics Industry Today.

PAI Sn99.3Cu0.7 RoHS Compliance Solder Sticks are being formulated with High Virgin Raw Metals Processed in state-of-the-art Vaccualloy Technology that brings world class Quality along. Here, Oxygen interaction with Alloy is Nil and thus, Dross formulation is reduced at PCB Assembly Process. Also an increase flow rate & reduced impurities found. PAI Sn99.3Cu0.7 Alloy is compatible for a typical range of Flux Application Formulas used in Electronics Industry Today.