Computer Chips Dealers

Argus is one of the Leading Electronics manufacturing services company with specialization in quick turnaround of Prototypes and low to medium scale production. This Unit has been established for both captive requirements and other enterprises that need electronic manufacturing services.PCB Assemblies (RoHS, Leaded) with highest Quality and on-time delivery. Focus on Engineering prototypes and Low-mid Volume manufacturing with Quick turnaround time.Assembly of Rigid, Semi-Rigid and Flex PCB's. Machine and manual soldering Options. Meticulous assembly backed by highly skiled professionals and process.

Our competitors to repair Northbridge and GPU issues which are common on most laptops, more so now that manufacturers are fitting higher end chips with ever higher failure rates.

A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. Ball-grid array packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds. Soldering of BGA devices requires precise control and is usually done by automated processes. A BGA device is never mounted in a socket in use.

BGA Chips are either available with the product on the time of purchase or can be bought separately from the market. The widely used laptop accessories used are laptop batteries, chargers, skins, Bags, and miscellaneous..

Since the mainstream of the new IC's chip package is shifting to BGA package from CBGA, CCGA, CSP, QFN, MLF, it becomes more difficult to do rework or repair on defective devices. Compared to said old type packages, BGA package's soldering points, a large number of solder balls, located under the bottom of the package and it hinders visual inspection as well a touch up rework. The only possible way to reworkrepair already processed BGA package on board is detaching it from board. However, once it is removed from the board then it solder balls are damaged and cannot be used unless damaged balls are replaced. Expert Institute offers all the necessary processes from detaching to testing to make BGA package with damaged solder ball reusable and as reliable as new one. We are the authorized distributor for BGA MACHINE.

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