Molex India Limited Tharamani, Chennai, Tamil Nadu

  • zSFP+ Interconnect System

    zSFP+ Interconnect System

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    zSFP+ SMT 20-circuit connectors and cage assemblies provide excellent signal integrity and EMI protection. zSFP+ SMT connectors support current 10 Gbps Ethernet and 16 Gbps Fibre Channel applications, with the ability to support up to 25 Gbps serial lanes. The preferential coupling design uses a narrow-edge, coupled blanked- and formed-contact geometry and insert molding to optimize electrical performance. The zSFP+ SMT connector shares the same PCB footprint, mating interface and EMI cage dimensions as the SFP+ SMT form factor, making it backward compatible. Single-port and 1x ganged cages are available to support multiple design options. Single-port cages feature press-fit, solder-post and PCI (1°) versions, providing a flexible solution for use with various board thicknesses and assembly processes at a comparable cost to SFP+ cages. EMI ganged cages utilizing new Gen II EMI belly gaskets provide superior EMI shielding compared to SFP+ cages. The press-fit tails accommodate belly-to-belly applications for both single and ganged cages to ensure the best use of PCB space. Cages will offer optional rear- and side-mounted lightpipe cover assemblies to allow for flexibility of PCB signal routing for LEDs. LC duplex cable assemblies, with optical mode three and four (OM3, OM4) fiber, are used with zSFP+ optical modules. LC duplex assemblies offer a high-performance interconnect solution with customization options for cable length and strain-relief boots including straight, 45° and 90°. LC loopback assemblies provide a stable and convenient means for testing SFP and SFF devices in many applications. Temp-Flex® 28 Gbps cable assemblies deliver next-generation data rates while delivering significant insertion loss improvements and enhanced cost efficiencies.

    Category : I/O Connectors

    Industry Standards : Ethernet, Fibre Channel

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  • zQSFP+ and QSFP+ Integrated Product Solutions

    zQSFP+ and QSFP+ Integrated Product Solutions

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    Pervasive bandwidth requirements due to the tremendous growth in wireless devices are the catalyst for large-scale (100 Gbps) system designs in server farms. zQSFP+ connectors transmit up to 25 Gbps per-serial-lane data rates with excellent signal integrity, relieving some of the pressure on core switches. The operating power for plugs was increased from 3.5 to 5W. The increased wattage also increased the heat generated, necessitating a thermally enhanced component to manage that extra heat. zQSFP+ Interconnect System with thermal protection offers three options to manage heat: a through-flow cage optimized to allow airflow through the midsection of the cage, an internal riding heat sink, and a top-riding heat sink to help increase airflow and manage the additional heat generated by the 5-watt plugs.

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  • Wire Pins

    Wire Pins

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    Molex Wire Pin Terminals like wire ferrules offer quick and easy connections in applications where set screws or clamps are used to make electrical contact with the wire. Wire Pins simplify the insertion of stranded wire into European-style terminal blocks and other components, by preventing wire strand foldback, assuring a proper electrical contact and a stronger connection than just wire alone.

    Feature : Fits all popular pin-type (European) terminal blocks,Available in wire sizes 10 to 22 AWG non-insula

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  • Watertite Wet-Location Wiring Solutions

    Watertite Wet-Location Wiring Solutions

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    Woodhead Watertite Wet-Location Wiring Devices set the standard for the roughest, wettest and most abrasive environments while meeting NEMA type 4, 4X, 6, 6P, IP65, IP66, and IP67 standards Electrical connections that are exposed to harsh environments both indoor and outdoor require a watertight connection to eliminate or reduce the risk of electrical shock. The Woodhead® Watertite® product line is the first in the industry allowing for a totally integrated watertight safety system with robust enclosures, plugs, receptacles, cover plates and GFCI modules to be applied exactly at the source required within customer applications. These devices are designed to reduce the occurrences of serious injury or death associated with electrical accidents. Woodhead® Watertite® wet-location products are rated for high-pressure hose-down applications up to 1,000 psi, achieving IP67 protection

    Category : Wiring Devices

    Features : Keeps out contaminants; resists vapor and water from high-pressure wash down up to 1000 psi,

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  • VITA 66.1 Ruggedized MT Optical Backplane Interconnect System

    VITA 66.1 Ruggedized MT Optical Backplane Interconnect System

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    Achieve installation and maintenance simplicity for rugged embedded VPX MILAERO backplane applications with the VITA 66.1 MT Optical Backplane Connector System

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  • VHDM Backplane Connectors and Cable Assemblies

    VHDM Backplane Connectors and Cable Assemblies

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    VHDM connectors and cable assemblies are available in 6- and 8-row configurations supporting data rates of 3.125 Gbps with less than 5% crosstalk. Individual wafers incorporate the signal pins and stripline shielding to allow 100% of the signal pins to be used for signal transmission. The grid of the mating face is 2.00mm between columns and 2.25mm between rows. The daughter card connectors are made from wafers. Each wafer has a column of signal contacts plus a ground shield, which are then mounted onto a stiffener to make a mono-block connector. Backplane headers are available in lengths of 10 and 25 columns; open and guide pin versions are available. Optional freestanding guide pins are available. These robust guide pins mount directly into the backplane PCB to accommodate heavier daughtercards. Cable assembly designs accommodate multi-wafer and custom back-shell solutions. In-house test equipment can verify design goals through Time Domain Reflectrometry (TDR) and impedance profile analysis.

    Feature : Offer 72 or 100 signal pins per 25.00mm., Control impedance and minimize crosstalk

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  • Vertical Solder Relief (VSR) Direct-Solder Crimp Terminals

    Vertical Solder Relief (VSR) Direct-Solder Crimp Terminals

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    Soldering wires into a PCB is a lengthy, complex process for customers. Customers must strip, twist and dip the wire strands while manually holding the wires in place during processing. This wiring process increases production time, introduces inconsistent results, and can lead to wire or solder joint failure when the wire is bent andor unsupported during side loads. When the wire hangs without support, it creates unwanted forces on the wire strands. This often leads to catastrophic failures within the unit. Molex’s Vertical Solder Relief (VSR) Direct-Solder Crimp Terminal solves all of these problems. The single, one-piece terminal design ensures easy processing of a reliable and cost-effective solution. With customers striving for greater reliability and lower processing costs, VSR Direct-Solder Crimp Terminal has become vital to single wire soldering PCB attachment during the manufacturing process for numerous applications.

    Feature : Increases reliability while lowering processing costs, Provides precise wire placement and st

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  • VersaKrimp Terminals

    VersaKrimp Terminals

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    VersaKrimp terminals and splices are as versatile as they are tough. Bonded with a special silver brazing alloy, VersaKrimp brazed-seam terminal barrels simply can not split, remaining terminated under conditions of stress or wire pull. VersaKrimp terminals can be crimped from any direction. VersaKrimp terminals are tin plated overall to reduce the potential for corrosion in harsh environments. Constructed with high-quality, oxygen-free copper, the conductivity is excellent and yields very low resistance across the interface and termination. A funnel-barrel entry terminal design facilitates easy and fast wire insertions. VersaKrimp terminals meet UL requirements when used with Molex recommended tooling only.

    Category : Solderless Terminals

    Style : Funnel-Barrel Entry

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  • VersaBlade Wire-to-Wire Connector System

    VersaBlade Wire-to-Wire Connector System

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    Multi-circuit applianceHVAC wire-to-wire applications, such as refrigerators, washing machines, heating units and ventilators, often use numerous power and signal connectors. However, multiple similarly-configured harnesses increase the risk of mis-mating and signal failure. Providing superior mating reliability, VersaBlade™ Wire-to-Wire Connectors enable both power and signal capabilities in one system with features that prevent mis-mating and resulting signal failure Additionally, assembly of multiple connectors to accommodate power and signal needs increases manufacturing time and costs. The VersaBlade System simplifies assembly process with a single connector for both power and signal, saving in harness production time and costs.

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  • ValuSeal Wire-to-Wire Connector System

    ValuSeal Wire-to-Wire Connector System

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    Consumer, transportation and industrial environments often demand connectors for signal and power applications that incorporate some type of sealing into their design. The ValuSeal™ Wire-to-Wire Connector System offers an IP65-rated, highly reliable sealed connector system. Its innovative design eliminates failures and issues associated with use of unsealed connector systems in adverse conditions. IP65-rated connectors are much too expensive, so these customers select unsealed connector offerings, leading to malfunctions and failures. A 1-piece design delivers reliable, sealed performance at an industry-best price point, eliminating failures and issues associated with use of unsealed connector systems in adverse conditions, and delivers valuable cost efficiencies.

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  • Ultrasonically Welded Lug Cable Assemblies

    Ultrasonically Welded Lug Cable Assemblies

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    Molex delivers Ultrasonically Welded Lug Cable Assemblies in sizes ranging from 1 AWG through 40 for rugged connections

    Feature : Reliable connection, superior performance and cable size benefits,Voltage drop less than 4.0 millivo

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  • Ultra+ VHDCI Interconnects

    Ultra+ VHDCI Interconnects

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    Ultra+ VHDCI connectors are a leafribbon style contact, also referred to as “blade on beam” contact that feature enhanced shields with multiple contact points for improved EMIRFI performance. Addition offerings include improved electrical performance, high density and robustness, as well as stacked receptacles that support twice the density of the standard right-angle receptacle. Standard cable assemblies are available in 1.0-, 3.0 and 5.0-meter lengths, with other cable lengths available upon request. Ultra+ VHDCI interconnects meeting the EIA, ANSISFF-8441 and SPI-4 specifications to ensure interminability with conforming products; Ultra+ VHDCI is well suited for high-density IO needs.

    Feature : Minimizes stubbing and improves insertion, Improved EMI/RFI performance and improved electric

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  • Ultra-Fit Power Connectors

    Ultra-Fit Power Connectors

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    Each industry faces different power connector challenges. Failures can occur in appliances as a result of mis-mated connectors. Terminal backout or other potential assembly errors can lead to dangerous brake malfunctions in vehicles. Pervasive data growth is driving PCB makers to use more electronics in smaller spaces; sourcing small, yet power-dense, electronics is a dilemma. Ultra-Fit Power Connectors address these issues, solving four key design challenges while offering the premium housing features of proven Mini-Fit and Micro-Fit 3.0 connector systems. Color-coded housings mitigate the risk of mis-mating. Optional TPA retainers significantly reduce terminal backout. A streamlined design that is 17% smaller than competing power connectors provides space savings, and an ultra-low mating force reduces operator fatigue when mating numerous high-circuit connectors.

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  • Type F RF Connectors

    Type F RF Connectors

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    Type-F 75 Ohm connectors are classified as miniature connectors. Type F connectors are used in a variety of RF applications including CATV and other 75 Ohm systems. Designs above 2 GHz are also available.

    Feature : Space-saving vertical mating, Ensures connector will not decouple in vibration intensive appl

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  • track-it Traceability Pad

    track-it Traceability Pad

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    The track-it Traceability Pad is a miniature identifier that provides unambiguous product traceability of work-in-progress (WIP) printed circuit boards (PCBs) in any high-volume electronics assembly process. Well suited for use in the medical industry, where stringent traceability requirements apply, the track-it identifier chip is suitable for any surface mount PCB assembly process where space is limited and traceability is required, including high-temperature, up to 350°C, ceramic PCB assemblies. In the course of the customer’s PCB manufacturing process, the track-it traceability pad is picked-and-placed alongside other components and the PCB is solder reflowed. Each PCB thereby gains a unique identification. This provides traceability data not only for the PCB, but also for all other components contained on the populated PCB and for the final assembled device. For customers with very high-volume requirements it is possible to produce custom part numbers with custom codes.

    Feature : Each track-it™ pad etched with an 8-digit code number,2D matrix code is open standard

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  • TNC RF Connectors

    TNC RF Connectors

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    TNC miniature connectors are considered mid-sized and use a threaded coupling arrangement. The stability of the threaded coupling allows the connectors to perform up to 11 GHz with improved resistance to adverse environments including vibration, moisture, corrosion and thermal variations. IP68 bulkhead versions are available. Typical applications include mobile communications, avionics and antenna ports for wireless base units.

    Feature : Miniature design,Threaded coupling

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  • TermiMate One-Circuit Terminal-Style Connector System

    TermiMate One-Circuit Terminal-Style Connector System

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    In LED lighting applications, components can sometimes create shadows if the profile is too high. Achieving the lowest-profile possible helps minimize any shadowing effects, while providing additional space savings to meet downsizing needs in all applications. Previous interconnect methods for lighting applications include two-piece housing style systems that are higher profile and require higher component and assembly costs; or direct-wire soldering, which saves space but does not allow for unmating and also creates a weak solder joint and risk of a faulty signal. In addition, some applications require both wire-to-board and board-to-board solutions, which traditionally would require separate board-to-board and wire-to-board mating components. Molex addresses these needs with the new TermiMate™ connector system by providing an ultra-low profile terminal-only system that prevents shadowing and offers wire-to-board and board-to-board options using the same plug terminal for design flexibility and component and assembly cost savings.

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  • Temp-Flex Standard Coaxial Cable

    Temp-Flex Standard Coaxial Cable

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    Reducing process time and labor costs, Temp-Flex® Standard Coaxial Cables offer electrical-length matching via tight tolerances and customizable formats to maximize ease of termination

    Feature : Highly consistent manufacturing process creates tight electrical and mechanical tolerances,Tight tim

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  • Temp-Flex Solid-Core Flexible Low-Loss Microwave Coaxial Cable

    Temp-Flex Solid-Core Flexible Low-Loss Microwave Coaxial Cable

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    Achieve superior phase stability and cutoff frequency with Temp-Flex Flexible Low-Loss Microwave Coaxial Cables, featuring a solid-core FEP (high purity) or PFA dielectric to meet stringent speed and electrical requirements mandated in military and industrial applications

    Feature : Extruded solid-core fluoropolymer (FEP or PFA) dielectric,Helically wrapped flat-wire shield with br

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  • Temp-Flex Multicore Cable

    Temp-Flex Multicore Cable

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    Temp-Flex Multicore Cables combine multifunction design with high-performance constructions to meet data, signal and power requirements for harsh-environment applications

    Feature : Tubing, strength members and Molex termination options available,Engineering design and test lab resources

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  • Temp-Flex MediSpec Micro Extrusion Primary Wires

    Temp-Flex MediSpec Micro Extrusion Primary Wires

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    Meeting tight tolerance requirements for invasive and implantable medical applications, Temp-Flex MediSpec Micro Extrusion Primary Wires deliver high reliability down to 52 AWG in a wide range of biocompatible conductor materials

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  • Temp-Flex MediSpec Micro Coaxial Cables

    Temp-Flex MediSpec Micro Coaxial Cables

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    Customize end-to-end coaxial assemblies while achieving high signal integrity and performance in critical medical applications with Temp-Flex MediSpec Microminiature Coaxial Cables

    Feature : Low-loss insulation material,Solid conductor down to 44 AWG wire,Diverse jacket options including biocompatible materials

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  • High-Density Micro-Ribbon Cables

    High-Density Micro-Ribbon Cables

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    Delivering optimum signal transmission and precise electrical length-matching capability in a compact size, Temp-Flex MediSpec High-Density Micro-Ribbon Cables are ideal for invasive and implantable medical applications

    Feature : Low-loss dielectric constant (down to 2.1) dependent on insulation material,Industry leader in fine-wire, fluoropolymer-insulated Micro-Ribbon Cable

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  • Temp-Flex Foam-Core Ultra-Low-Loss Coaxial Microwave Cable

    Temp-Flex Foam-Core Ultra-Low-Loss Coaxial Microwave Cable

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    Medical, test and measurement and aerospace and defense industries require cables that are reliable in harsh environments and are easy to terminate. Microwave cables with air-enhanced PTFE insulation achieve minimal loss characteristics, but these cables experience a “phase knee” effect at room temperature, meaning environments with temperature swings can affect cable performance. Temp-Flex Foam-Core Ultra-Low-Loss Coaxial Microwave Cable, with fluoropolymer insulation delivers stable performance at a range of temperatures while attaining competitive loss characteristics as compared with air-enhanced PTFE. Space-constrained applications, such as medical and test and measurement, require cables that are not only stable in varying temperatures, but also have small outer diameters. Temp-Flex Foam-Core Ultra-Low-Loss Coaxial Microwave Cable offers sizes down to 1.194mm shield OD, making it ideal for applications with strict space limitations.

    Insulation : Fluropolyer

    Feature : Fluoropolymer insulation eliminates the “phase knee” effect,Achieves 80% velocity of propagation (VO

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Services

  • Brad Foundation FieldBus Solutions

    Brad Foundation FieldBus Solutions

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    Foundation Fieldbus is a communication protocol used to interconnect field-level instrumentation and control devices to a PLC (Programmable Logic Controller) or DCS (Distributed Control System) controller in a process-automation control system. Foundation Fieldbus is employed in the control systems of oil and gas production, refineries, petrochemical plants, chemical manufacturing, and pharmaceutical manufacturing. At the physical-layer level, Foundation Fieldbus allows multiple devices to communicate digitally over the same wire. The Foundation Fieldbus physical layer (such as cable or transmission signal requirements), is specified in the ISA SP50.02 and IEC 1158-2 standard for fieldbuses. The cable specifications are listed in the cable standard, FF-844, which is issued by the Fieldbus Foundation, the organization that controls and maintains this open standard. Molex's Brad Foundation Fieldbus products are fully complaint to these specifications. Brad Foundation Fieldbus products from Molex are based on the proven Mini-Change and Micro-Change circular, molded-connector families. These sealed, watertight connectors offer the ruggedness required in the most demanding industrial applications. The pre-wired, keyed connectors provide a modular wiring system that is not prone to field-wiring termination errors. Molex provides a quick and efficient wiring solution for Foundation Fieldbus installations, no matter how demanding the environment.

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  • Brad Foundation FieldBus Solutions

    Brad Foundation FieldBus Solutions

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    Foundation Fieldbus is a communication protocol used to interconnect field-level instrumentation and control devices to a PLC (Programmable Logic Controller) or DCS (Distributed Control System) controller in a process-automation control system. Foundation Fieldbus is employed in the control systems of oil and gas production, refineries, petrochemical plants, chemical manufacturing, and pharmaceutical manufacturing. At the physical-layer level, Foundation Fieldbus allows multiple devices to communicate digitally over the same wire. The Foundation Fieldbus physical layer (such as cable or transmission signal requirements), is specified in the ISA SP50.02 and IEC 1158-2 standard for fieldbuses. The cable specifications are listed in the cable standard, FF-844, which is issued by the Fieldbus Foundation, the organization that controls and maintains this open standard. Molex's Brad Foundation Fieldbus products are fully complaint to these specifications. Brad Foundation Fieldbus products from Molex are based on the proven Mini-Change and Micro-Change circular, molded-connector families. These sealed, watertight connectors offer the ruggedness required in the most demanding industrial applications. The pre-wired, keyed connectors provide a modular wiring system that is not prone to field-wiring termination errors. Molex provides a quick and efficient wiring solution for Foundation Fieldbus installations, no matter how demanding the environment.

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Contact Information

Molex India Limited

  • Jaijo Varghese
  • Ist floor, Origin ITFS Dr. V.S.I Estate, Phase II, Taramani, Tharamani, Chennai, Tamil Nadu
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