Binding Systems Dealers

EVG offers high precision, fully integrated and highly automated wafer Bond Aligner systems for bonding application such as anodic, silicon fusion, thermo-compression and eutectic bonding.   The alignment and bonding process separation results in higher flexibility and universal application of the wafer bonding equipment. The EVG bond alignment systems offer highest precision, flexibility, ease of use and modular upgrade capability and have been qualified in numerous high throughput production environments. The precision of EVG bond aligners accommodates most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications. A maximum level of automation and process integration is achieved by the GEMINI Automated Production Wafer Bonding System. Wafer-to-wafer alignment and wafer bonding processes up to 200 mm (300 mm) for volume manufacturing are all performed in one fully automated platform. Device manufacturers benefit from increased production output, a high integration level and a big choice of process variations like anodic, silicon fusion, thermo-compression and eutectic bonding. Ultra clean handling of wafers throughout the bonding process assures high-yield and void-free bonds. All essential steps, from cleaning and alignment to pre-bonding and IR-inspection are combined in one high volume production system. EVG850 is the only production bonding system built to operate in high throughput, high-yield environments and guarantees void-free SOI wafers up to 300 mm.

For sliding gates up to 800 kg   Operational safety (24 V technology)   Simplified bus connection system FAST NET

We are one of the trusted Suppliers of highly efficient Electronic Coil Binding Machine. Our Electronic Coil Binding Machine is a solid & robust full scape size electric punching machine with automatic spiral inserter. Electronic Coil Binding Machine that we offer is ideal for general office to high volume use. The compact size and easy operation of our Electronic Coil Binding Machine makes it an ideal choice. Specifications : Max. Punching ability : 30 sheets(70-80gsm) Max. Binding ability : 500 sheets Margin adjustable range : 2/4/6mm, Hole distance : 6.35mm Hole size : Ø4x5mm in Oval, Number of holes : 46 holes selective all on pull-push pin Power Supply : 110/220v, 50/60Hz, Power Consumption : 120W N.W. : 25kgs

We supply Thermal Binding Machine, sourced from renowned dealers. The Thermal Binding Machine we offer is in demand for use in diverse Commercial sectors. Thermal Binding Machine undergoes meticulous quality tests before being sent to the market. Avail from us the Thermal Binding Machine at economical prices within the scheduled time frame. Features : Built-in Paper Clamp ProducingPerfect BindBuzzer Sound Upon BindingCompletionBuilt-in Cooling RackOne Hand Operation1 mm to 40 mm binding capacity