Silicon Wafers Dealers

• Size: 5 Inch
• Type: N-type/P-type As Requirements
• Brand Name: NRE
• Material: Silicon Wafer
• Thickness: 180-1000 um (+/-25) As required
• Growth Method: CZ/FZ As Requirements
• Surface: Single side polished/Double side polished

products specification     silicon wafer 2” 3” 4” 5” 6” 8” size (inch)   diameter 50.8±0.3 76.2±0.3 100±0.5 127±0.5 154±0.5 200±0.5 (mm )   growth cz/fz as requirements method   grade prime / test / dummy grade   thickness 180-1000 um (+/-25) as required   orientation 100 / 110 / 111   type n-type/p-type as requirements   dopant p-type: boron   n-type: phosphorous/antimony/arsenic   particle ≤30 @0.3um   oxygen ≤18 new ppma content   carbon ≤1 new ppma content     resistivity 1-10ohm/cm   others ttv≤15um, bow≤65um, warp≤65um   surface single side polished/double side polished.

• Type: N-type, P-type and intrinsic type
• Thickness: 10 µm to 1mm
• Orientations: <100>, <110>, and <111>
• Diameter: 25.4mm (1”) to 450mm (17.6 inches)
• Surface Resistivity: < 1 ohm/sq. to 50000 ohms/sq.
• Surface: Single side polished (SSP) or double side polished (DSP)
• Applications: Semiconductor manufacturing, Computers and PC’s, Smartphone, Tablets, Wearable’s .

• Type: Wafers
• Certification: FSSAI Certified
• Shelf Life: 1year

All types of Silicon wafers & sizes, thickness, etc.

• Growth Method: Directional
• Conductivity Type: P-Type
• Dopant: Boron
• Resistivity: 0.5-2 Ω cm
• Oxygen Content: 8 × 1017 atom/ cm3
• Carbon Content: 5 × 1016 atom/ cm3

• Diameter: 50mm-300mm
• Type : P or N
• Drientation : <100><111>
• Resistivity : As Specified
• TTV : As Specified
• Site Flatness : As Specified
• Final Thickness: >=50um (dependant on wafer diameter)
• Surface Finishes : Lapped, Ground, Etched, Polished

A wafer, also called a slice or substrate, is a thin slice of semiconductor material, such as a crystalline silicon, used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells. The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many microfabrication process steps such as doping or ion implantation, etching, deposition of various materials, and photolithographic patterning. Finally the individual microcircuits are separated (dicing) and packaged. We are selling high grade, factory sealed silicon wafers since the 2006’s. Wafers are available from our stock in every diameter and grade, with an emphasis on 100mm, 200mm and 300mm Prime and Test device quality wafers. MG maintains a large inventory of Cz, FZ, low defect, ultra flat, and tightly controlled metals specifications etc. Because wafer specifications are unique to every semiconductor design, we offer the possibility to custom build to your requirements.

• Country of Origin: India
• Color: Grey
• Material: Powder or flakes

In order to meet urgent and voluminous requirements of the customers, we have installed all the in-house facility at our premises. Laced with modern facilities, it helps us in securing the product line from factors like, moisture, dust, sunlight, etc. We are backed by a reliable team of packaging professionals and modern facility that aid us completely for furnishing standard as well as tailored packaging requirements of the patrons.

• Type: Silicon Wafers
• Material: Silicon
• Shape: Round
• Thickness: 1-5 Mm
• Application: Solar High-tech Industries
• Pattern: Plain
• Finishing: Polished
• Packaging Type: Vacuum Bag Packed
• Polished Side: Single Side Double Side
• Size: 2 inch to 4 inch
• Brand Name: SCM

• Type: Wafers
• Shelf Life: 1year

Customized high Purity silicon wafers, Si+SiO2 wafer, Silicon on Insultors wafers for industrial and research applications. Wafer are customized as per your requirements. Kindly provide details like orientation, doping etc for customization.

• Material: Metal
• Shape: Round
• Thickness: 0.5mm
• Pack Type: Vaccum Bag
• Usage: Research,Laboratory

Silicon Wafer, Orientation: 100, SSP N Type Boron, Diameter: 50.8mm , 100-150 ohm.cm Type Dopant: N-Boron, Thickness: 275um Single Side Polished Stock No: NPT-SW-1

• Wafer Thickness: 200 ± 20 μm etc
• Wafer Length: 125, 156 mm

Monocrystalline silicon wafers widely used in commercial photovoltaic cell production. A substantially improved efficiency for a monocrystalline silicon solar cell. The improved monocrystalline cell performance results from enshrouding cell surfaces in thermally grown oxide to reduce their detrimental electronic activity and from isotropic etching to form an hexagonally symmetric “honeycomb” surface.The wafer length is 125-156mm,diagonal length is 150-165 mm and different sizes are available.

• Features: Easy to use , High strength, Longer life.
• Use: Used in PVD film coating industry
• Item Code: NPT-SW-1

• Material: Silicon 
• Country of Origin: Made in India
• Thickness: 500um
• Type: N Type
• Purity: 99.9%
• CAS: 7440-21-3
• Diameter: 3 inches
• Form: Wafer
• Doping: Phosphorous
• Growth Method: CZ
• Laser Mark: None
• Edge Profile: Rounded
• Front Side Surface: Polished
• Stock no: NS6130-10-1003
• Features: Highly effective, Kill bacteria and other germs, Skin friendly
• Pay Mode Terms: L/C (Letter of Credit),T/T (Bank Transfer)

• Color: Violet
• Oxide Thickness: 90 nm
• Wafer thickness: 525 microns
• Resistivity: 0.001-0.005 ohm-cm
• Front Surface: Polished

INFICON market-leading thin film deposition controllers, monitors and QCM measurement instruments control deposition rate and thickness of the most complex processes with unsurpassed measurement speed and precision. Enhanced software and logic I/O features allow the our thin film deposition controllers.

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