Plating Services in Ecil, Hyderabad (3 service providers available)

Similar to stainless steel in color, Plates uniformly in recesses and cavities (does not build up on edges). Corrosion resistance is good for coatings over .001 thicknesses. Electro less Nickel is used extensively in salvage of miss-machined parts. Also for inside dimensions and irregular shapes (where assembly tolerances need uniformity provided by Electro less process). Class 2      Baking Schedule to Achieve Hardness Class 1  As coated.   Class 2 Steel, copper, nickel, cobalt-titanium based alloys and any basis metal not   adversely affected by heating as specified. Class 3   Aluminum alloys non-heat-treatable, and beryllium alloys processedto improve   adhesion of nickel deposit. Class 4     Aluminum alloy, heat-treatable, processed to improve adhesion of the                 nickel deposit. Grade A   .001” Min. thickness Grade B   .0005” Min. thickness Grade C    .0015” Min. thickness (for severe corrosion protection).

Electroless gold is deposited from a solution purely as the result of the reaction of chemicals in the bath. The electroless plating bath is comprised of several of the same items found in an electrolytic gold plating bath, but it also includes chemicals (reducing agents) to provide electrons for the reaction and other chemicals (chelating agents and stabilizers) to control the reaction so that it can be predictable and controllable as a manufacturing process.   Why Does It Matter Which Process is Used to Plate?Is the Deposit the Same?To plate a part using an electrolytic process, every surface to be plated must be connected electrically so that it can act as the cathode in the plating cell. This becomes difficult for many products but especially for electronic circuits that generally need to have electrically isolated surfaces to be functional. Over the course of the development of the electronics industry it has become common practice to design in connections to tie different surface metal patterns together just for plating and then to remove these connections after plating. The manufacturing inefficiencies of this are obvious but a greater problem is the restriction this places on the final performance and circuit density of the component. Using electroless gold plating, circuits can be designed and fabricated in their final configuration. This saves the manufacturer several steps but more importantly it allows the circuit design to place primary consideration on optimum circuit performance and minimum circuit size. The electroless gold deposit is identical to an electrolytic pure gold deposit (i.e., Mil-G-45204 C Type III or ASTM B488 Type 1 hardness code A) in essentially every way; thickness, purity, hardness, grain size, density and color. The primary difference from an electrolytic gold deposit is it's second distinct advantage... improved thickness distribution. Electrolytic plating creates deposits that have thickness variations resulting primarily from the shape of the electrical field between the cathode surfaces and the anode. These deposits are thicker on corners and edges and surfaces where the distance to the anode is shortest. They are also thinner in the middle of surfaces, inside of holes and on surfaces facing away from the anode. Electroless plating completely eliminates this source of variation. Electroless gold plated deposits are uniform in thickness around corners, on both sides of a part, even on the inside walls of small holes that may be very deep.  

We are into gold plating of pcb's , articals,jewellery and other precision plating works like silver,nickel etc..