We are offering mica paper heater plates.
Composition :
several layers of muscovite mica paper impregnated with epoxy binder and cured under pressure to form plates having excellent mechanical, thermal, and electrical properties.
Applications:
insulation medium in induction, arc & ladle furnaces, circuit breakers, hydraulic & forging presses etc.
We are offering mica paper heater plates.
Composition :
several layers of muscovite mica paper impregnated with epoxy binder and cured under pressure to form plates having excellent mechanical, thermal, and electrical properties.
Applications:
insulation medium in induction, arc & ladle furnaces, circuit breakers, hydraulic & forging presses etc.
We are offering mica splitting flexible plates.
Composition is made from mica splittings bonded with flexible alkyd resin which exhibits excellent flexibility and formability at room temperature. Different grades are available depending on the type of mica & binder content.
Application:
for class “b” applications such as cone insulation, d.c. Coil separators, pads of field coils, under cross cover and lead terminals and as mechanical pads.
We are offering mica splitting flexible plates.
Composition is made from mica splittings bonded with flexible alkyd resin which exhibits excellent flexibility and formability at room temperature. Different grades are available depending on the type of mica & binder content.
Application:
for class “b” applications such as cone insulation, d.c. Coil separators, pads of field coils, under cross cover and lead terminals and as mechanical pads.
We are offering mica splitting heater plates.
Composition:
is a heat resistant epoxy resin bonded mica plate. A low binder content burns off during the initial exposure to heat. No residue will remain if sufficient air is available. During operation, no deleterious matter is released, which could interfere with contacts such as thermostats.
We are offering mica splitting heater plates.
Composition:
is a heat resistant epoxy resin bonded mica plate. A low binder content burns off during the initial exposure to heat. No residue will remain if sufficient air is available. During operation, no deleterious matter is released, which could interfere with contacts such as thermostats.
We are offering mica paper segment plates.
Composition:
Is an Epoxy resin bonded mica paper plate milled to NEMA grade 3 P thickness tolerance. The epoxy resin is fully cured to “C” stage giving the material maximum resistance to flow under thermal and compressive stresses.
We are offering mica paper segment plates.
Composition:
Is an Epoxy resin bonded mica paper plate milled to NEMA grade 3 P thickness tolerance. The epoxy resin is fully cured to “C” stage giving the material maximum resistance to flow under thermal and compressive stresses.
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