silicon wafer
Type : N-type, P-type and intrinsic type
Thickness : 10 µm to 1mm
Orientations : <100>, <110>, and <111>
Diameter : 25.4mm (1”) to 450mm (17.6 inches)
Surface Resistivity : < 1 ohm/sq. to 50000 ohms/sq.
Surface : Single side polished (SSP) or double side polished (DSP)
Applications : Semiconductor manufacturing, Computers and PC’s, Smartphone, Tablets, Wearable’s .