Is a complete rework-station for both leaded and non-leaded SMDs and components. It come equipped with a selective soldering de - soldering work head, a PCB-bottom Infra - red Hot - air Pre-heater, and a Hot-air solderingdesoldering gun with interchangable profiled flow-nozzels. The PCB is held in rails on an X-V table. It is a most efficient BGA (ball-grid-array) rework (solderingdesoldering) system and can be used for all surface - mounted - devices including chip components, J-Lead, SO, VSO, QFP, PLCC packages. The SMDs are soldered using the reflow technique by applying solder-paste on PCB prior to the reflow soldering process. BGA packages have pre-deposited solder balls on them and hence do not require solder-paste. Soldering by the Hot-air reflow process is done at a temperature that is only 20-30°C higher then the melting point of the solder alloy, thereby reducing possibilities of damage to the PCB and the SMD. Hot air at precise tamperture and flow - rate is directed at the solderable points, while the bottom of the PCB has been preheated to avoid any thermal shock or stress to the device or PCB tracks to achieve a zero defect soldering of the SMD Package.
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