Conductive Paste Dealers in Kurukshetra

(3 products available)
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    Tungsten Conductor Paste

    Tungsten Conductor Paste

    10 - 50 / Pack

    • MOQ100 Bottle
    • Brand NameNanochemazone
    • Chemical NameW
    • Chemical NameTungsten Conductor Paste
    • Molecular Weight183.85
    • Melting Point3410 ºC
    • Boiling Point5900 ºC
    • Product NumberNCZ-P-112
    • CAS No7440-33-7
    • Pack Size10 mL, 25 mL, 50 mL and 100 mL
    • Bulk Pack Size250 mL, 500 mL and 1000 mL
    • Tungsten Conducting Paste $0.00 Tungsten Conductor Paste Linear Formula: W Chemical Name: Tungsten Conductor Paste Molecular Weight: 183.85 Melting Point: 3410 ºC Boiling Point: 5900 ºC Product Number: NCZ-P-112 CAS No: 7440-33-7 Pack Size: 10 mL, 25 mL, 50 mL and 100 mL Bulk Pack Size: 250 mL, 500 mL and 1000 mL
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  • Conductive Paste +1

    Conductive Paste

    10 / Gram

    • MOQ10 Gram
    • MaterialSilver
    • ApplicationScreen Printing
    • FormPaste
    • Packaging Size100g, 10g, 20g, 50g
    •   Conductive Silver Paste   Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high-power semiconductor devices. The main role of thermal paste is to eliminate air gaps or spaces (which act as thermal insulation) from the interface area in order to maximize heat transfer and dissipation. Thermal paste is an example of a thermal interface material.   Related Information   Purity                                      99.9 % Molecular Weight                   107.87 g/mol Resistivity                               1.59 micro ohm/cm at 20 Degree C Maximum Service Temp.        150 Degree C Packaging Type                       Box Storage Conditions: Airtight sealed, Avoid light and keep dry at Room Temperature.   
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  • Conductive Silver Paste

    Conductive Silver Paste

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    • MOQ5 Gram
    • Purity99.9 %
    • Molecular Weight107.87 g/mol
    • Resistivity1.59 micro ohm/cm at 20 Degree C
    • Maximum Service Temp.150 Degree C
    • Packaging TypeBox
    • Storage ConditionsAirtight sealed, Avoid light and keep dry at Room Temperature.
    • Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high-power semiconductor devices. The main role of thermal paste is to eliminate air gaps or spaces (which act as thermal insulation) from the interface area in order to maximize heat transfer and dissipation. Thermal paste is an example of a thermal interface material.
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