Hans Laser technology LBS Marg, Mumbai, Maharashtra

1. Various metal materials, part of non-metal materials. 2. The fiber optic laser oscillator marker has advantage of high beam quality and high reliability. It is suitable for processing fields that need high marking depth, smoothness and accuracy.

Application : Marking

W150G utilizes a laser source that excites Nd: YAG crystal using a pulsed Xenon lamp that resonates to create a laser with a wavelength of 1064 nm. With good beam quality, fine laser spot, strong penetration, and fiber transmission, an excellent non-co High aspect ratio, thin weld width, narrow heat affected zone, zero deformation, and fast welding speed. 2. The weld is smooth and clean, with or without simple process after welding. 3. High weld strength, no porosity, eliminates the impurities of the base metal, the microstructure can be refined after welding, the weld strength is at least equal to or even exceed the base metal strength. 4. Tiny laser spot can be precisely positioned and easily automated. 5. Fit for some dissimilar metal welding. 6. Spot welding, butt welding, overlap sealing welding. 7. Various metals such as gold, silver, platinum, stainless steel, titanium, and their alloys.

Adjustable repetition frequency Modular design TEM00 output High average power output, up to 30W Leveraging the extremely small heat-affected zone of "cold processing", it can achieve ultra-fine processing and microstructure production of non-metallic brittle materials in the high-end manufacturing fields, which is widely used in the 3C industry, especially in the key processes of cellphone industry chain. At present, more than 15,000 machines have been launched, leading the market share of similar lasers. Applications 1. PCB, FPC marking, de-panel, cutting and drilling; 2. Silicon wafer micro-hole and blind hole processing; 3. Solar cell process 4. Silicon wafer scribing 5. Ceramic scribing, cutting and drilling 6. Removal of printing ink, PVD coating 7. Material surface marking

Application : industrial

Design : Modular

Average Power Output : Up To 30W

Heat Affected Zone : Extremely Small

Material : Non-metallic Brittle Materials

Adjustable repetition frequency, ranging from 20kHz to 200kHz Integrated design of optical and control system TEM00 output As a new product with innovative design, it adopts proven intra-cavity frequency doubling technology and has been applied to various precision marking processes in batches. As UV laser breaks through the power limit and has unique super-high cost performance, its application is rapidly increasing and will have a breakthrough in the field of extreme manufacturing. Applications Marking of high-end electronic product LOGO Marking of food, PVC pipes, pharmaceutical packaging & cable wire (HDPE, PO, PP, etc.) PCB & EPC QR code marking Metallic or nonmetallic coating removal Marking of air switch & low-voltage electrical appliances (flame-resistant materials)

Technology : Intra-cavity Frequency Doubling Technology

Design : Integrated Design Of Optical And Control System

Repetition Frequency Range : 20kHz - 200kHz

Output : TEM00

Application : industrial

Glass thickness: 0.1-1.2mm 2、Edge breakage size: ＜0.005mm 3、Processing speed: 4s/pcs, 115*60mm, R5mm,DOL

Glass Thickness Range : 0.1mm - 1.2mm

Edge Breakage Size : <0.005mm

Processing Speed : 4 Seconds Per Piece

Processing Area Size : 115mm X 60mm

Minimum Processing Radius : 5mm

The machine is mainly used in the assembly and welding of the fixed structure parts of the back cover camera of IT products such as mobile phones and PAD. Modular design better for machine maintenance, more than 87% OEE data. 2, Well designed machine structure and its related fixture, product yield is over 99.5%. 3, The whole machine design is compact and reasonable, with 9.5s processing CT. 4, Data processing and transmission are stable with success rate of over 99.5%.

Usage : Assembly And Welding Of Fixed Structure Parts

The movement is realized by high-precision linear motor, which drives the X-Y axis to the corresponding position, and the software triggers the light cutting and marking according to the pattern; After all products are cut and marked, there are audible an The movement is realized by high-precision linear motor, which drives the X-Y axis to the corresponding position, and the software triggers the light cutting and marking according to the pattern; After all products are cut and marked, there are audible and visual instructions. This scheme has the characteristics of high production efficiency, convenient operation, stable performance and good cutting and marking effect. Control mode: Motion control card Cutting mode: CO2 laser Automation level: Manually feeding, adsorption and fixation, automatic cutting. Other characters: It is equipped with vacuum adsorption platform and exhaust system; It locates the product on the loading platform easily; A smoking pipe is installed near the cutting point to extract the smoke generated during cutting. Application: label, PET film such products Specification Motion platform linear platform X axis(300mm), Y axis(300mm), The manual up and down lifting stroke of the worktable is 250mm Platform precision repeated positioning precision 0.02mm Max processing area 400mm*300mm Power single phase220V/50HZ Air source 0.6~0.9MPa Overall size(L*W*H) 1250mm*2100mm*1750mm

The dicing process used in the production of high-efficiency photovoltaic modules replaces the conventional laser dicing machine The core principle of non-destructive laser cutting is laser thermal stress controlled fracture technology, which uses laser to locally heat the material and produce a temperature gradient on the material surface, so as to induce the generation of thermal stress, and induce the stable fracture of the material through appropriate control of thermal stress. Non destructive laser cutting can realize low-temperature processing and avoid the ablation damage of solar cells. Main Features there is no laser thermal damage on the battery section and no laser thermal influence on the surface good mechanical performance and high conversion efficiency; maximum capacity ≥ 7200p / h, multiple configurations are optional; widely compatible with mainstream and new crystalline silicon battery products; ndependent intellectual property rights, multiple core patents.

Color : Depends On Manufacturer, Typically Industrial Colors Like Grey Or Blue

FP series is a new generation near-infrared semiconductor pumped fiber laser. With good beam quality, fiber transmission and high electro-optical conversion efficiency, It is mainly used for rapid welding thin materials. . High aspect ratio, thin line weld width, narrow heat affected zone, zero deformation, and fast welding speed. 2. Smooth and clean weld with or without simple process after welding. 3. High weld strength, no porosity, eliminates the impurities of the base metal. 4. The microstructure can be refined after welding, Weld strength is at least equal to or exceeds base metal strength. 5. Tiny laser spot can be precisely positioned and easily automated. 6. Suitable dissimilar metal welding. 7. Excellent for spot welding, butt welding, overlap sealing welding. Applications: ● Battery welding, pipe welding, thin steel plate welding ● Electronic components, instrumentation, medical equipment, small metal parts welding Material, ● Stainless Steels, Carbon Steels ● Gold & Silver, Aluminum, Tool Steels ● Nickel Alloys, Brass & Copper, Titanium

Usage : Battery Welding,Pipe Welding,Thin Steel Plate Welding

The sensor welding system is a solution for the assembly and welding of three parts: sensor pressure ring, sensor sheet and sensor core base. In view of the lack of coordination in the assembly of sensor products and the high demand of coaxiality, special Double worktables, increasing output. Strong university, the replacement of fixture is simple and can be compatible with different products with different outer diameters, Equipped with dust extraction function to reduce the welding smoke Equipped with air blowing protection to ensure the effect of welding surface Industrial control system, good man-machine interface, simple operation Fully enclosed safety protection cover, set up access control and safety interlock to secure operation safety.

The WFD series is a diode laser that uses diode materials to illuminate between energy bands. Two parallel mirror surfaces inside the diode are formed as a resonant cavity, which illuminates the light, and outputs laser of wavelength 915 nm. With fiber t . Pulsed, continuous dual working mode; 2. A more diverse way of working; 3. Low maintenance cost and low power demand, zero consumables, electro-optical conversion efficiency up to 47%; 4. Better integrated applications for on-site placement and integration; 5. Compact structure space makes handling, management and maintenance more convenient and free. Application: Widely applied to the reinforcement and sealing welding of plastics Medical plastic parts. 1. Auto plastic parts. 2. Plastic bottle sealing welding. 3. Plastic pipe sealing welding. 4. Oxygen mask sealing welding.

Material : Diode Materials

With the rise of photovoltaic double-glass modules, the demand for drilled back glass is increasing, With the rise of photovoltaic double-glass modules, the demand for drilled back glass is increasing, and the drilling quality has become a key process link affecting the production of back glass. In response to the low-cost drilling requirements of thin glass, Han's Photovoltaic Equipment has developed high-precision, high-efficiency precision laser drilling equipment. Main Features Compatible with mainstream glass specifications (600*1200~1200*2500mm, thickness 1.6-5mm); The equipment includes acceleration section, rotation section, laser drilling section, rotation section and deceleration section; Compatible with long-side feeding (shingled type) and short-side feeding (conventional); The processing cycle is as fast as 6 pieces/min (diameter 12mm, thickness 2mm); Using highly stable laser, the process effect is stable.

1. With high-performance UV laser and self-developed control software. 2. With the high-precision motion platform system and high-precision galvanometer scanner. 3. With high-precision CCD positioning system. . With high-performance UV laser, the laser cutting heat-affected zone is small and it can more efficiently process the high-density and highly integrated PCBA product 2. The self-developed control software has functions of multiple jointed board cutting, automatic focusing and distortion compensation to achieve high-precision processing 3. With the high-precision motion platform system and high-precision galvanometer scanner, the cutting precision is high 4. The high-precision CCD positioning system can ensure the product’s processing precision 5. The machine can be integrated into the production lines and connected to various loading and unloading devices for cutting without manual operation. Application Field 1. Suitable for precision cutting, half cutting, trenching of materials such as FPCBA, PCBA, RF, CVL and SIP. 2. Applicable for the product precise processing of auto industry and electronic industry.

Model Number : HDZ-CL4030

1. With high-performance UV lase and self-developed control software. 2. With the high-precision motion platform system and high-precision galvanometer scanner. 3. With high-precision CCD positioning system With high-performance UV laser, the laser cutting heat-affected zone is small and it can more efficiently process the high-density and highly integrated PCBA product 2. The self-developed control software has functions of multiple jointed board cutting, automatic focusing and distortion compensation to achieve high-precision processing 3. With the high-precision motion platform system and high-precision galvanometer scanner, the cutting precision is high 4. The high-precision CCD positioning system can ensure the product’s processing precision. Application Field: 1. Suitable for precision cutting, half cutting, trenching of materials such as FPCBA, PCBA, RF, CVL and SIP 2. Applicable for the high-quality cutting of coverlay, PI, FR4, FR5 and CEM materials 3. Applicable for the precise processing of electronic industry like mobile phone fingerprint module, camera module, integrated chip..

Good dynamics & cutting ability: High rigidity welded body with die-cast aviation aluminum gantry, improve the gantry strength and much lighter, enjoy good stability & durability; Easy operation & intelligent: Adopt the professional digital control system, which is developed by Han’s MP, achieving the HANS digital control system with the features of good performance, high reliability and convenient operation. Low running cost: Low accessing gas consumption by precision control, to ensure the low running cost, three kinds of auxiliary gas can be choose freely by customer. Item Parameters Processing area 3000mm×1500mm X/Y axis location accuracy ±0.05mm/m X/Y axis repeat location accuracy ±0.03mm Max running speed 120m/min Max running acceleration 1.2G Max load of worktable 700kg Power supply 380V/50HZ Machine tool weight About 5.5T

Material : High Rigidity Welded Body, Die-cast Aviation Aluminum Gantry

Usage : Cutting

High processing accuracy: Equip with high torque servo motor and high precision imported reducer, high efficiency, favorable dynamic characteristics;Good dynamics & cutting ability: High rigidity welded body with die-cast aviation aluminum gantry, improve the gantry strength and much lighter, enjoy good stability & durability; Easy operation & intelligent: Adopt the professional digital control system, which is developed by Han’s MP, achieving the HANS digital control system with the features of good performance, high reliability and convenient operation.

It is commonly applied to mold manufacturing industries including mobile phone, digital product, automobile and motorbike. Laser welding spot diameter is small, heat affected area is small and pore, collapse, thermal strain and metallographic structure change will not occur after welding, greatly decreasing post-welding treatment process. 2. Microscope co-axis observing focusing positioning aiming, liquid crystal light valve and full reflection eye protection devices. 3. Stable operation, the ability to realize continuous working and intermittent working. 4. XYZ high rigid worktable, high repeated positioning precision. 5. It can effectively repair all cracks, chips and damages.

1. Can be suitable for a variety of materials: steel, aluminum, silver, gold, silicon. 2. Suitable for various industries: Electronic components industry Medical device industry Glasses, watch and clock industry IC card industry Jewelry industry . Utilizes the world's largest source of Fiber lasers-IPG Photonics. 2. Adopts the newest generation of laser marking control. 3. Integrates the encoder data port which can get the assembly line speed real time that is for flying marking application. 4. Adopts one key starting with a simple interface. 5. The appearance is compact with a simplified air cooling system. Was developed according to CE and FDA/CDRH standard, meeting the strictest safety requirements. Specification: Model MARS-10J MARS-20J Laser output power 10W 20W Wavelength 1064nm 1064nm Beam quality M2

It is suitable for semiconductor and photovoltaic fields. For TOPCon process cells in the photovoltaic field, LPCVD equipment can complete the preparation of tunnel oxide layer/poly layer in one stop. The combination of thermal oxygen and poly layer depos It is suitable for semiconductor and photovoltaic fields. For TOPCon process cells in the photovoltaic field, LPCVD equipment can complete the preparation of tunnel oxide layer/poly layer in one stop. The combination of thermal oxygen and poly layer deposition can greatly increase production capacity, while compatible with i/d-Poly growth process. Main Features Mature high-capacity process, dual-mode temperature control technology, film gauge protection technology; With a variety of coating technologies: multi-layer composite film, doped polysilicon technology; Patented rapid cooling furnace body: The latest patented technology makes the furnace body temperature drop to the required temperature quickly, and the cooling rate can be increased by more than 25%, which can improve the temperature uniformity in the furnace tube obviously; Fast adaptive pressure closed-loop control technology; MES/CCRM system with complete architecture and outstanding performance; Integrated industrial computer + Modular process control software; Comprehensive power failure safety treatment and abnormal protection of flange water.

Low-pressure diffusion is currently considered to be an effective way to effectively improve the conversion efficiency of solar cells. Low-pressure diffusion is currently considered to be an effective way to effectively improve the conversion efficiency of solar cells. Low-pressure diffusion/scattered oxidation annealing improves the molecular free path of the diffusion source and solves the problems of diffusion depth and uniformity; compared with atmospheric pressure diffusion, it has some significant advantages, such as high productivity, high square resistance, process repeatability, Low source consumption, clean and environmentally friendly, etc. This equipment is mainly used for the diffusion doping and oxidation annealing process of silicon wafers in the manufacture of crystalline silicon solar cells. Main Features Mature high-capacity process, loading and unloading system: balanced and symmetrical design to enhance stability; Rapid cooling furnace body: The latest patented technology makes the furnace body temperature drop to the required temperature quickly, the cooling rate is increased by more than 25%, which can improve the temperature uniformity in the furnace tube obviously; The exhaust gas is collected by high-efficiency water-cooled condenser to ensure stable and reliable operation of pipes, valves, filters and diaphragm pumps and long maintenance periods; Stable design of anti-interference source pipeline to reduce square resistance fluctuation caused by disturbance of environmental factors; MES/CCRM system with complete architecture and outstanding performance.

Material : Silicon

Usage : Diffusion Doping And Oxidation Annealing Process Of Silicon Wafers

Conversion Efficiency : Improved Through Low-pressure Diffusion

Advantages : High Productivity, High Square Resistance, Process Repeatability

The laser welding system of motor stator core is a semi-automatic equipment designed for laser welding and forming of stator core of block DC motor; The laser welding system of motor stator core is a semi-automatic equipment designed for laser welding and forming of stator core of block DC motor; The laser welding machine adopts 4-way fiber transmission, manual feeding, automatic pressing into the fixture, rotating for 3 times, and completing 12 welds. It is equipped with Ventilation system, dust removal, safety protection and other functions. Industrial control system, friendly man-machine interface, simple operation, stability and reliability System Characters The energy of laser beam is concentrated, welding speed is fast, post welding deformation is minor, heat effect zone is small 4-way fiber transmission and 4 welding joints equipped, welding at the same time The double claw structure realizes the feeding and blanking at the same time, improving efficiency. High welding precision. Automatically popping up from the fixture makes the automatic feeding convenient. Industrial control system, friendly man-machine interface, simple operation Equipped with protection cover, access control and safety interlock, operation safety secured.

Application : Welding And Forming Of Stator Core Of Block DC Motor

Suitable for thin film batteries such as CIGS, CdTe, perovskite, and color-changing glass. Mainly used in P1/P2/P3 laser scribing of thin film solar cells, and laser insulation scribing The thin film battery is divided into small pieces by laser scribing and connected in series at the same time, so as to reduce the loss of electric energy and increase the output voltage Main features The processing quality is good, cut without residue and does not hurt the bottom. The line width is consistent, and the process flow is stable; Different processing graphics; Multi-head simultaneous processing, high processing efficiency. Main Parameters Basic function Thin-film solar cells P1/ P2/ P3/ laser scribing/ P4 laser edge cleaning (select laser corresponding to different processes) Can customize thin film solar cell/BIPV/smart photovoltaic glass solution Laser generator lifetime 10000 hours Work hole diameter 1500mm/s The position of the holes that can be machined multi-channel simultaneous machining Minimum center distance of machinable holes Round, square spot Machining hole position accuracy ±0P1: 20-60um, P2: 40um-80um P3: 40um-80um Laser power >2MΩ Hole appearance requirements >1GΩ@1KV

Usage : Thin-film Solar Cells P1/P2/P3 Laser Scribing, Laser Insulation Scribing

Mainly used for laser pattern processing of solar screen printing PI film material screen or stencil removal for meshless screen production Good processing quality: no burning, no glue residue, good line width consistency in film cutting; no residue in steel mesh cutting, less dust adhesion; High flexibility: Compatible with conventional screen and non-knotted screen, you can choose a variety of cutting methods; High precision: high-precision CCD positioning system + high-precision XY platform (repeated positioning accuracy ±1um).

Usage : Laser Pattern Processing, Stencil Removal

The laser marking machine can code cigarettes, package cigarettes, strip cigarettes, and cigars, which can play the role of anti-counterfeiting, traceability management and so on. Application Can code (number, text, QR code, anti-counterfeiting code, invisible code, etc.) on cigarettes, packs, strips, cigars, etc. System character Marking control card: personalized customization can be provided at any time. Exclusive high-performance data processing chip is adopted, which has the ability of marking without gap. With high-strength metal protective structure and excellent heat dissipation performance, it has better protection and uninterrupted working ability than ordinary bare PCB boards; External optical path: fully enclosed optical path system to better protect optical devices from external environment. Marking direction: the laser beam head can be selected downward, horizontally or upward according to the application to meet different application types. The structure of light path can also be customized to meet the light output from other angles. Communication: the equipment is equipped with standard network port, serial port, USB port and extended function bit to facilitate data communication and hardware expansion

Application : Coding (number, Text, QR Code, Anti-counterfeiting Code,Anti-counterfeiting, Traceability Management

Material : High-strength Metal Protective Structure